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Note: The job is a remote job and is open to candidates in USA. Micron Technology is a world leader in innovating memory and storage solutions. As a Dry Etch Process Engineer, you will develop, integrate, and optimize plasma etch processes for next-generation memory devices, collaborating closely with various teams to transition processes from R&D to high-volume manufacturing.
Responsibilities
Develop, qualify, and sustain dry etch (plasma) unit processes for advanced memory technologies (e.g., dielectric, conductor, and hardmask etch)
Optimize critical process metrics including CD control, etch profile/anisotropy, selectivity, microloading, uniformity, and line edge/line width roughness
Drive defect reduction and yield improvement using inline/out-of-line metrology, DOEs, SPC, and statistical data analysis
Perform root-cause analysis and implement corrective actions for process excursions, tool health issues, and integration-related failures
Partner with equipment vendors on chamber matching, hardware and recipe development, new capability evaluations, and cost-of-ownership improvements
Document process baselines, change controls, and learning; communicate results and support technology transfer to high-volume manufacturing
Skills
M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, or a related engineering/technical field relevant to plasma processing and semiconductor manufacturing
B.S. with 3+ years of semiconductor processing experience with emphasis on dry etch/plasma etch will also be considered
Experience in semiconductor process development or sustaining engineering, including DOE planning/execution and statistical data analysis
Working knowledge of plasma etch fundamentals, chamber hardware, and process characterization (profile, CD, selectivity, uniformity, defectivity)
Ability to collaborate effectively across cross-functional technical teams and communicate results clearly
Hands-on experience with advanced dry etch platforms (e.g., ICP/RIE) and chamber matching across fleets
Familiarity with pattern transfer challenges (ARDE, microloading, footing/notching) and integration with lithography/hardmask stacks
Experience with defect characterization techniques and tool health monitoring methodologies
Experience working with semiconductor equipment vendors, joint development programs, or R&D environments
Familiarity with technology transfer to high-volume manufacturing and sustaining support in a fab environment
Benefits
Additional compensation may include benefits, bonuses and equity.
We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
Additionally, Micron benefits include a robust paid time-off program and paid holidays.
Company Overview
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips. It was founded in 1978, and is headquartered in Boise, Idaho, USA, with a workforce of 10001+ employees. Its website is
Company H1B Sponsorship
Micron Technology has a track record of offering H1B sponsorships, with 107 in 2026, 569 in 2025, 428 in 2024, 299 in 2023, 626 in 2022, 564 in 2021, 538 in 2020. Please note that this does not guarantee sponsorship for this specific role.